Related Equipment

Useful Enhancements for FINEPLACER® Systems

Finetech offers various stand-alone solutions to flexibly enhance a FINEPLACER® workplace. Outsourcing specific process steps make for an optimized workflow as well as significantly increased through-put.

MINIOVEN 04 - BGA Reballing - Stand Alone System

Description

The MINIOVEN 04 is a compact and flexible IR reballing solution suitable for a wide range of SMD components. It provides smart functions such as integrated air circulation, nitrogen support and the easy-to-use interface. The optimized heat distribution allows even heating of the whole component. Combined with nitrogen unwanted oxidation process will be significantly reduced. The benefits are obvious: excellent wetting behavior of lead-free solders, increased surface tension and drastically improved long-time stability.

The MINIOVEN 04 integrates the entire temperature cycle for a defined reflow of grid arrays (e.g. BGA/CSP) and QFN/MLF components. Thanks to the intuitive, display supported user interface it is a breeze to work with and edit the up to 99 different soldering profiles. The integrated profile library makes finding the process parameters for newly added component classes more comfortable than ever.  Variable soaking time and target temperature as well as adjustable offset and damping add to the process stability.

The MINIOVEN 04 is the ideal supplement for all FINEPLACER® rework stations. The compact tabletop device provides a stand-alone solution for component preparation which makes it an alternative to the BGA Reballing Module.

Highlights*

  • MINIOVEN 04 N

  • Compact tabletop device
  • Integrated nitrogen support
  • Cost-efficient solution for BGA reballing and QFN printing
  • Optimized heat distribution
  • Intuitive operation
  • Integrated profile library
  • Wide selection of accessories

* depending on configuration

Technical Specifications

Component size (min.)15 mm x 15 mm
Component size (max.)55 mm x 55 mm x 4 mm
Heated area105 mm x 130 mm
Power (max.)500 W, 4 IR lamps
Temperature ramp rateLimited to 3.5 K/s
Process gas supplyyes
Temperature sensors1 intern (stationary), 1 extern (free)
Number of programs (max.)25
Dimension outside150 mm x 300 mm x 85 mm

HOTBEAM 04 - IR Pre-heating Solution

Description

The compact and flexible IR underheater HOTBEAM 04 is the ideal supplement to a FINEPLACER® rework station. With modest space requirements and an overall height of only 40 mm, the IR underheater can be accommodated on every working table while providing very ergonomic operation. In engineering and research labs it is the premium choice for pre-heating and manual rework of small boards, e.g. of mobile devices. The HOTBEAM 04 allows storage of up to 99 different temperature profiles.

Highlights*

  • HOTBEAM 04

  • Compact tabletop device
  • Cost-efficient pre-heating solution
  • Ergonomic design
  • Even heat distribution
  • Intuitive operation

* depending on configuration

Technical Specifications

Heating area130 mm x 105 mm
Power50 W - 500 W
Heated area130 mm x 105 mm
Temperature ramp rateLimited to 3,5 K/s
Heating temperature (min.)50°C
Heating temperature (max.)260°C
Number of programs (max.)99

*Technical data are standard values (other values on request). Specifications given are subject to change without notice and may not be used as a basis for a binding offer or quotation.

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