From May 8 to 10 at SMT 2012, booth 6-406, Finetech will present new developments and improvements for the hot gas rework station FINEPLACER^® core.

At SMT 2012 on booth 6-406 Finetech will present the latest rework and bonder generation FINEPLACER^® matrix.

Intel^® Corporation has recognized Finetech with an Appreciation Award presented by Intel’s Equipment Vendor Enabling program.

Finetech announces that it has been awarded a Global Technology Award in the category of Bonding Equipment for its FINEPLACER^® matrix ma.

On September 29, Finetech was pleased to welcome assembly & bonding professionals from Germany and Europe to the Berlin headquarters...

Sep 6-9, 2012
Location: Shenzhen Convention & Exhibition Center
Booth: tba.
On display: tba.